Materials Science Engineering Applications

📣 CARBON FIBER STRUCTURAL BATTERIES! 📣 Researchers at Chalmers University of Technology has developed a groundbreaking carbon fiber battery that integrates energy storage and structural functionality, revolutionizing the potential of lightweight, multi-functional materials. By leveraging carbon fiber's dual properties as both a conductor and a structural material, the researchers created a battery that can store energy while also serving as a load-bearing component. This innovation eliminates the need for separate energy storage systems, offering significant weight savings and increased efficiency, particularly for applications such as electric vehicles and aircraft. 😍 The project focuses on optimizing the carbon fiber's electrochemical and mechanical properties to balance energy density and strength. Recent advancements include a carbon fiber material with improved stiffness and energy storage capacity, coupled with a solid-state electrolyte for enhanced safety and durability. The research demonstrates the viability of structural batteries, opening new possibilities for sustainable design and the development of lighter, more efficient systems in transportation and other industries. 👏 Video Source: Interesting Engineering on Facebook #composites #composite #compósitos #compositematerials #materialsengineering #fibers #lightweight #reinforcedplastics

Choosing the Right PCB Material: A Key Design Decision The PCB substrate you choose plays a critical role in determining performance, reliability, and cost. Different applications require different materials—here’s a quick overview: 1. FR-4 (Flame Retardant 4) The most common and cost-effective option. Ideal for general-purpose electronics. Good mechanical strength and decent electrical performance, but limited in high-frequency applications. 2. Rogers (High-Frequency Laminates) Engineered for RF and microwave applications. Low dielectric loss and excellent signal integrity make it perfect for 5G, radar, and aerospace systems. 3. PTFE (Teflon-Based) Excellent for very high-frequency and high-speed circuits. However, it's expensive and harder to process. Used in advanced communication and satellite systems. 4. Metal-Core PCB (Aluminum/Copper Core) Designed for power electronics and LED lighting. Superior thermal conductivity helps dissipate heat efficiently. 5. Polyimide High thermal stability and flexibility. Great for flexible and rigid-flex PCBs used in wearables and aerospace applications. 6. Ceramic-Based PCBs Offer outstanding thermal and electrical properties. Suitable for extreme environments like automotive, aerospace, and industrial control systems. Each material serves a purpose. The key is to align your choice with the electrical, thermal, and mechanical demands of your application. What material do you swear by in your designs—and why? Share your experience! #PCBDesign #ElectronicsDesign #MaterialsEngineering #FR4 #Rogers #HighFrequency #HardwareDevelopment #ThermalManagement

Sunlight-Powered Self-Cooling Fabric Revolutionizes Clothing In a Chinese materials science lab, researchers have developed an innovative textile that harnesses sunlight to cool the wearer, requiring no electricity, fans, or chemicals. Utilizing radiative cooling, this fabric could redefine clothing for hot and humid environments. Crafted from a layered polymer composite embedded with nanoparticles, the fabric reflects visible sunlight while emitting body heat as infrared radiation, effectively channeling warmth away from the skin and into space. Outdoor tests showed wearers stayed 5 to 7°C cooler than those in cotton or synthetic fabrics, even in direct sunlight. Unlike moisture-wicking materials, this textile cools independently of sweat or humidity, maintaining effectiveness in muggy conditions. Breathable, washable, and visually indistinguishable from regular clothing, the fabric is produced using scalable roll-to-roll methods, making it suitable for commercial fashion, workwear, military uniforms, tents, and blankets in hot climates. Already in trials for construction gear and heat-stress suits, this passive cooling technology could save lives as global temperatures climb, reducing reliance on air conditioning. After millennia of clothing for warmth, we’re now weaving fabrics that keep us cool. #china #chinesetech #chinesetechnology #technews #technologynews #fashion #highendfashion #luxuryfashion #luxurygoods

Your next power electronics design just got more complicated. Silicon carbide and gallium nitride semiconductors are rapidly displacing traditional silicon in high-performance applications. But which wide-bandgap technology should you choose? Here's what the numbers tell us: 𝗚𝗮𝗡 𝗱𝗼𝗺𝗶𝗻𝗮𝘁𝗲𝘀 𝗶𝗻 𝘀𝘄𝗶𝘁𝗰𝗵𝗶𝗻𝗴 𝗽𝗲𝗿𝗳𝗼𝗿𝗺𝗮𝗻𝗰𝗲: • Highest bandgap energy: 3.39 eV (vs SiC's 3.26 eV) • Superior electric field blocking: 3.3 MV/cm capability • Electron mobility: 1500-2000 cm²/V.s range • Lower parasitic capacitance with 9.0 relative permittivity 𝗦𝗶𝗖 𝘄𝗶𝗻𝘀 𝗳𝗼𝗿 𝘁𝗵𝗲𝗿𝗺𝗮𝗹 𝗺𝗮𝗻𝗮𝗴𝗲𝗺𝗲𝗻𝘁: • Thermal conductivity: 4.9 W/cm.K (3.8x better than GaN) • Better heat dissipation in power-dense applications • Preferred choice for high voltage applications above 650V 𝗥𝗲𝗮𝗹-𝘄𝗼𝗿𝗹𝗱 𝗶𝗺𝗽𝗹𝗶𝗰𝗮𝘁𝗶𝗼𝗻𝘀 𝗳𝗼𝗿 𝘆𝗼𝘂𝗿 𝗱𝗲𝘀𝗶𝗴𝗻𝘀: GaN enables: • Higher switching frequencies (reducing passive component sizes) • Lower on-state resistance (improving efficiency) • Faster switching times (reducing losses) SiC delivers: • Better thermal performance in high-power applications • More reliable operation at elevated temperatures • Proven track record in automotive and industrial power systems 𝗧𝗵𝗲 𝗺𝗮𝗿𝗸𝗲𝘁 𝗿𝗲𝗮𝗹𝗶𝘁𝘆: Major suppliers now offer GaN FETs up to 1200V. Companies like GaN Systems, Transphorm, and Innoscience are pushing GaN into traditional SiC territory. But here's the catch - GaN's thermal conductivity (1.3 W/cm.K) remains significantly lower than SiC. This limits GaN in applications where heat dissipation is the primary concern. 𝗕𝗼𝘁𝘁𝗼𝗺 𝗹𝗶𝗻𝗲 𝗳𝗼𝗿 𝗲𝗻𝗴𝗶𝗻𝗲𝗲𝗿𝘀: Choose GaN when you need: • High-frequency switching (>100 kHz) • Compact form factors • Maximum efficiency in moderate power applications Choose SiC when you prioritize: • High voltage operation (>650V) • Maximum power density • Superior thermal management The data comes from recent industry analysis comparing fundamental material properties and commercial device specifications. Both technologies continue advancing rapidly. Is GaN ready to challenge SiC dominance in high-voltage applications, or will thermal limitations keep it in niche markets? __ 𝗣.𝗦.: 𝗛𝗮𝘃𝗲𝗻'𝘁 𝗮𝗹𝗿𝗲𝗮𝗱𝘆 𝗷𝗼𝗶𝗻𝗲𝗱 𝗺𝘆 𝗟𝗶𝗻𝗸𝗲𝗱𝗜𝗻 𝗴𝗿𝗼𝘂𝗽 𝗳𝗼𝗿 𝗽𝗼𝘄𝗲𝗿 𝗲𝗹𝗲𝗰𝘁𝗿𝗼𝗻𝗶𝗰𝘀? 𝗛𝗲𝗿𝗲 𝗶𝘀 𝘁𝗵𝗲 𝗹𝗶𝗻𝗸 𝘁𝗼 𝗷𝗼𝗶𝗻: https://lnkd.in/gnh8e9pS

Woke up thinking about next-gen nanomaterials in automotive. Nanomaterials are engineered at the atomic level through: 1 / Nanostructuring 2 / Grain refinement 3 / Surface functionalization The ideas is to break traditional trade-offs in performance, efficiency, and durability — because at the nanoscale, material properties behave fundamentally differently. 1 / Performance Nanograin-refined metals increase strength without brittleness, enabling lighter, crash-resistant components that outperform conventional alloys. 2 / Efficiency Silicon nanoparticle anodes store nearly 10x more lithium than graphite, increasing EV range and charging speed without adding battery weight. 3 / Durability Self-healing nanopolymers release repair agents on damage, extending the lifespan of coatings, lubricants, and structural materials in vehicles. The theory of nanomaterials eliminates traditional trade-offs in automotive engineering — where improving one property (strength, efficiency, durability) normally comes at the expense of another. Now, we can have all three. But while nanomaterials are no longer just theoretical, mass production remains a major challenge. Carbon nanotubes, graphene, and quantum dots have seen industrial-scale production, but scalability, cost, and quality control still limit broader adoption. As with most efforts in deep tech, the challenge isn’t just proving the technology — it’s making it commercially viable at scale. In the 2000s, I thought the nanorevolution would come much sooner. Thoughts??? If you’re building hard things and want signal over hype, subscribe to Per Aspera. 👉🏻 Join here: https://lnkd.in/gqvHKmUC

Headline: China Breaks Hypersonic Barrier with Heat Shield That Survives 6,512°F Introduction: Pushing the boundaries of aerospace engineering, Chinese scientists have developed a revolutionary heat-resistant material that could dramatically advance hypersonic flight. Withstanding temperatures as high as 3,600°C (6,512°F) in oxidizing environments, this breakthrough in ceramic carbide technology far exceeds the limits of current aerospace materials. Key Details: Unprecedented Thermal Resistance: • The new carbide ceramic material withstands 3,600°C (6,512°F)—a temperature threshold that surpasses existing aerospace heat shields. • For comparison: • Most metal alloys fail above 2,000°F. • SpaceX’s Starship uses heat shield tiles rated to 2,500°F (1,371°C). • This represents a significant leap for aerospace and defense systems operating in extreme thermal conditions, such as hypersonic missiles and space reentry vehicles. Scientific Breakthrough: • Developed by a team at South China University of Technology, led by Professor Chu Yanhui. • The innovation lies in a “high-entropy, multi-component” design—a materials science strategy that combines several elements to produce stable, heat-tolerant structures. • Published in the peer-reviewed journal Advanced Materials, the research confirms that oxidation resistance and thermal stability can now be pushed beyond previous global limits. Strategic Implications: • Hypersonic flight—defined as speeds over Mach 5—requires materials that can survive intense friction and heat during atmospheric transit. • This new ceramic could dramatically enhance China’s capabilities in hypersonic weapons, high-speed aircraft, and space exploration. • The breakthrough signals China’s growing edge in next-generation materials science, a field critical to global defense and aerospace competition. Why This Matters: This development not only marks a technological milestone but also escalates the strategic race in hypersonic and aerospace systems. The ability to maintain material integrity at such extreme temperatures could reshape the future of military deterrence, space travel, and atmospheric reentry design. As nations pursue faster, farther, and more resilient vehicles, China’s new ceramic positions it as a global leader in the high-stakes domain of advanced aerospace materials. Keith King https://lnkd.in/gHPvUttw

𝙃𝙤𝙬 𝙙𝙤 𝙮𝙤𝙪 𝙘𝙝𝙤𝙤𝙨𝙚 𝙩𝙝𝙚 𝙧𝙞𝙜𝙝𝙩 𝙥𝙞𝙥𝙞𝙣𝙜 𝙢𝙖𝙩𝙚𝙧𝙞𝙖𝙡? ✅ Fluid Characteristics - Type of fluid: water, steam, oil, gas, chemicals, corrosive media. - Corrosiveness: Is it acidic, alkaline, saline, or non-corrosive? - Toxicity & flammability: For hazardous fluids, material must be more robust and safe. - Cleanliness: For food, pharma, and semiconductor industries, hygienic stainless steel is a must. ✅Operating Conditions - Pressure (normal, medium, high, very high) → dictates wall thickness & material strength. - Temperature (cryogenic, ambient, high temp) → affects thermal expansion, creep resistance, and material selection. - Phase (gas, liquid, slurry, steam) → abrasive slurry requires erosion-resistant materials. ✅Mechanical Properties - Strength (yield, tensile, toughness). - Hardness (abrasion resistance). - Flexibility & ductility (ability to handle expansion/contraction). ✅Corrosion Resistance - Carbon steel for non-corrosive services. - Stainless steel (304, 316, 321, etc.) for corrosive, food, and pharma industries. - Special alloys (Duplex, Inconel, Hastelloy, Titanium) for highly aggressive environments. ✅Codes & Standards - ASME B31.3 (Process Piping). - ASME B31.1 (Power Piping). - API, ASTM, DIN, EN standards depending on industry & location. - Company specifications (PMS – Piping Material Specification). ✅Economics - Carbon steel is cheaper but needs corrosion allowance/lining. - Stainless & alloys are expensive but reduce maintenance & increase service life. - Balance between CAPEX (initial cost) and OPEX (lifetime maintenance). ✅Fabrication & Availability - Weldability, machinability, ease of forming. - Local availability of pipes, fittings, and spares. - Delivery time and vendor qualifications. ✅Special Considerations - Fire safety (e.g., non-combustible materials). - Regulatory requirements (FDA for food/pharma, NACE for sour service in oil & gas). - Thermal expansion (materials with high expansion coefficients may need special design considerations). ⚙️ Common Materials in Piping ➡️ Carbon Steel (CS): Cheap, widely used, but limited corrosion resistance. ➡️ Stainless Steel (SS): Corrosion & heat resistant (common grades: 304, 316, 321, Duplex). ➡️ Alloy Steels: For high temperature & pressure (e.g., Cr-Mo steels in refineries). ➡️ Non-metallics (PVC, CPVC, HDPE, PTFE, FRP): For corrosive, low-pressure, or water services. ➡️ Exotic Alloys (Inconel, Monel, Hastelloy, Titanium): For very harsh chemical or high-temperature service. ✅ In practice, companies prepare a Piping Material Specification (PMS) document that lists allowable materials for different services (fluid, pressure, temperature) based on the above factors. #piping #corrosion #pipingengineering #steel #mechanicalengineering #engineering

Next generation computers: new wiring material could transform chip technology : https://lnkd.in/e57yPGWM One of the many challenges is that electronic components generate increasingly more heat as they are miniaturised. A significant issue lies in making the wires which connect the transistors on the chip thinner while ensuring that the minimum amount of heat is released. A group at Stanford University has published a new paper showing that thin films of a material known as niobium phosphide (NbP) exhibit much higher conductivity than copper below a thickness of 5 nanometres (nm) (the typical thickness of the wiring in today’s chips is about 10nm-30nm). This improvement is because NbP is a material with unique quantum properties. #semiconductor #manufacturing #technology #innovation #chips  #semiconductormanufacturing #advancedtechnology #engineering #lithography #nanometer #research #development #AI  #mobileprocessors #EUV #DUV

EVs are all the rage right now but… there’s still a long way to go when it comes to improving efficiency and reliability. Sharing some more interesting things I’ve been learning from the Coherent team on next-generation materials 👇 (Warning: about to nerd-out below — For a non-science person like me, this is absolutely fascinating.) Heat challenges: Electric vehicles generate significant heat in their traction inverters, which concert DC current from batteries to AC for the motor. Excessive heat can decrease the efficiency and the lifespan of electronic components. This means effective cooling is crucial for EV design. Current solutions: Traditionally, cooling is accomplished by mounting the power electronics and other heat-generating components on a water-cooled baseplate. This cools the electronics by transferring the heat away. Right now, most baseplates are made from copper (which has good thermal conductivity and efficiently moves the heat away from its source) or aluminum (which has a lower thermal conductivity than copper but is much lighter). However, neither of these metals are the ideal material for baseplates because they have differing expansion rates compared to the electronics they cool, leading to mechanical stress and potential damage of the packaging. An alternative: The ideal baseplate material has 1) high thermal conductivity 2) closely matches the thermal expansion characteristics of electronics packaging and 3) is mechanically strong, hard, corrosion resistant and lightweight. This is where the science comes in. Our team has developed reaction-bonded silicon carbide (RBSiC) that meets many of these requirements. It has high thermal conductivity and better matches the thermal expansion properties of electronic packaging materials. It also exhibits high mechanical strength, resistance to corrosion and chemical inertness, among many other advantages. Short story here: Materials — the physical stuff that we make things out of — is just as critical to our future as any software or algorithm. It’s so exciting to be able to see innovation happening at this level. More information from Coherent Corp. linked in the comments.